Flux composition for solder, solder paste, and method of soldering
US7575150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2007 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Mar 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.