Flexible molding device for manufacturing a sunken groove in a tire tread
US7575424B2 · kind B2 · utility
0Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2007 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Oct 26, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D2030/0613
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold and molding device for forming a sunken groove in a tire is provided. The molding device includes a thin flexible wire having a desired cross-sectional shape. The wire thickness can range from about 0.5 mm to about 5 mm. The flexible wire is preferably hyperelastic. An optional molding element may be connected to the flexible wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.