Molding system including body overlapping and sealing conduits, amongst other things
US7575428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Mar 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49945
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Molding system for filling mold with molding material, comprising: extruder, including: barrel configured to process molding material being pushable from barrel; barrel head operatively attached to barrel; screw disposed in the barrel; and screw drive connected to screw; stationary platen support a stationary mold portion; movable platen configured to be movable relative to the stationary platen; and body overlapping and sealing, at least in part, barrel and barrel head, body including: flange received at interface between barrel and barrel head, flange abutting end of barrel, flange abutting end of barrel head; and outer surface protruding from flange into interior of barrel, outer circumferential surface protruding from flange into interior of barrel head, outer surface sealing and overlapping against: (i) inner surface of barrel, and (ii) inner surface of barrel head; and body having coefficient of thermal expansion being: (i) greater than barrel, and (ii) greater than barrel head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.