Polycrystalline diamond abrasive elements
US7575805B2 · kind B2 · utility
39Cited by
24References
18Claims
0Family size
Inventors
Key dates
| Filing date | Dec 9, 2004 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Oct 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A polycrystalline diamond abrasive element, particularly a cutting element, comprises a layer of polycrystalline diamond having a working surface and bonded to a substrate, particularly a cemented carbide substrate, along an interface. The polycrystalline diamond abrasive element is characterized by using a binder phase that is homogeneously distributed through the polycrystalline diamond layer and that is of a fine scale. The polycrystalline diamond also has a region adjacent the working surface lean in catalyzing material and a region rich in catalyzing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.