Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
US7575812B2 · kind B2 · utility
2Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Jul 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.