Heat-sensitive recording material, heat-sensitive recording method and method for manufacturing heat-sensitive recording material
US7576036B2 · kind B2 · utility
1Cited by
3References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 2, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Sep 25, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03C1/002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat-sensitive recording material including at least one heat-sensitive recording layer and a protective layer provided in this order on a support, wherein the protective layer contains a compound represented by the following Formula (1) and/or a compound represented by the following Formula (2), a method for manufacturing the heat-sensitive recording material, and a heat-sensitive recording method using the heat-sensitive recording material provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.