Mechanical packaging of surface acoustic wave device for sensing applications
US7576470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Aug 1, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.