Patent · US Active

Memory interface to bridge memory buses

US7577039B2 · kind B2 · utility

34Cited by

17References

16Claims

0Family size

Assignee

Montage Technology, Inc. · CN

Inventors

Howard Yang · Milpitas, US
Stephen Tai · Shanghai, CN
Gang Shan · Nanhu, CN
Larry Wu · Sunnyvale, US

Key dates

Filing date	Aug 10, 2006
Grant date	Aug 18, 2009
Priority date	—
Expiry date	Sep 2, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH05K1/181
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A memory interface to bridge a parallel memory bus and a serial memory bus. A printed circuit board includes at least one memory interface buffer chip to connect an advanced memory buffer (AMB) interface and one or more non-fully buffered memory modules.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.