Heat dissipating device
US7578337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2005 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/12
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.