Adhesion promoter
US7579394B2 · kind B2 · utility
2Cited by
26References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2007 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Dec 26, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesion promoter for a hot melt adhesive or a pressure sensitive adhesive prepared by admixing a hydrolytic silane compound with an aqueous buffer solution. The adhesive is able to bind at very low surface free energy substrates, such as Xerographic prints contaminated by silicone fuser oil. The hot melt adhesive maintains a substantially stable viscosity at temperature ranging from about 100° C. to about 200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.