Heat sink arrangement for electrical apparatus
US7579554B2 · kind B2 · utility
0Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2006 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Jan 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.