Adjusting a characteristic of a conductive via stub in a circuit board
US7579925B2 · kind B2 · utility
5Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2006 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Apr 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0949
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.