Advanced antenna integrated printed wiring board with metallic waveguide plate
US7579997B2 · kind B2 · utility
4Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2007 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Oct 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q13/06
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A system and method of constructing a phased array antenna system that incorporates a printed wiring board assembly with a metallic waveguide plate is provided. The system uses a metallic waveguide plate to dissipate heat toward and through the waveguide portion of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.