Semiconductor cooling system for use in electric or hybrid vehicle
US7580261B2 · kind B2 · utility
9Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2007 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Sep 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.