Method and system for the modular design and layout of integrated circuits
US7581198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2006 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Jun 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end-application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, the physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.