Method of manufacturing a chassis assembly to reduce electromagnetic interference
US7581303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Oct 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49936
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a chassis assembly to reduce electromagnetic interference is disclosed. The method includes forming a chassis having a chassis cover top portion, a chassis cover step portion, a chassis cover pre-step portion, a hemmed edge, a hemmed lip, and one or more dimpled spring fingers, by forming a first bend at the hemmed edge residing between the hemmed lip and the chassis cover pre-step portion, forming a second bend between the chassis cover step portion and the chassis cover pre-step portion, and forming a third bend between the chassis cover top portion and the chassis cover step portion. The method further including forming a fourth bends between a chassis back top portion and a chassis back. The formed chassis cover is then seated with the chassis back to create a tortuous path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.