Electronic component mounting apparatus
US7581310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Jan 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.