Plating method
US7582199B2 · kind B2 · utility
4Cited by
25References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2005 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Nov 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.