Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
US7582403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2006 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Aug 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.