Method for making a microcircuit card
US7584537B2 · kind B2 · utility
0Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2002 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Dec 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.