Method for recording microstructural changes in a component

US7584669B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Michael Dankert · Offenbach, DE
• Martin Feldhege · Berlin, DE
• Stefan Irmisch · Untersiggenthal, CH
• Matthias Oechsner · Wetter (Ruhr), DE
• Eckart Schumann · Wetter (Ruhr), DE
• Werner Stamm · Mülheim an der Ruhr, DE

Key dates

• Filing date: Feb 14, 2005
• Grant date: Sep 8, 2009
• Expiry date: Jun 26, 2025

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02T50/60
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Method for recording microstructural changes in a layer system component. A specific material parameter of the component is measured. The layer system may include an alloy substrate and an alloy or porous ceramic layer. The material parameter may be measured a plurality of times. The measured material parameter may include electrical capacitance, specific heat capacity, peltier coefficient or magnetic susceptibility. The material parameter may first be measured on a new component and subsequent measurements may be performed at a time interval after operational use. The recorded material parameter is then used to determine microstructural changes in the substrate or the layer material of the component caused by changes in precipitation, cracks, or depletion of an alloying element.