Patent · US Active

Heat-insulating layer made of complex perovskite

US7585575B2 · kind B2 · utility

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1References
4Claims
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Inventors

Key dates

Filing dateDec 19, 2008
Grant dateSep 8, 2009
Priority date
Expiry dateDec 19, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12951
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A heat-insulating layer has a melting point above 2500° C., a thermal expansion coefficient in excess of 8×10−6 K−1, and a sintering temperature greater than 1400° C. This material has a perovskite structure of the general formula A1+r(B′1/2+xB″1/2+y)O3+z in which:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.