Heat-insulating layer made of complex perovskite
US7585575B2 · kind B2 · utility
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Key dates
| Filing date | Dec 19, 2008 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Dec 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12951
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-insulating layer has a melting point above 2500° C., a thermal expansion coefficient in excess of 8×10−6 K−1, and a sintering temperature greater than 1400° C. This material has a perovskite structure of the general formula A1+r(B′1/2+xB″1/2+y)O3+z in which:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.