Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon
US7585907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2004 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Aug 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2211/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides an inorganic powder-containing resin composition capable of forming a dielectric layer having high light transmittance and excellent in surface smoothness. The invention also provides a film-forming material layer, a transfer sheet and a dielectric layer, which comprise the composition, a method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon. The inorganic powder-containing resin composition comprises inorganic powder, a binder resin, and a phosphorus compound represented by formula (1):wherein R1, R2 and R3 independently represent H, an alkyl group, an alkylaryl group, NH4+ (ammonium) or —(CH2CH2O)n—R4, wherein n is 1 to 15, and R4 represents H, an alkyl group, an alkylaryl group or a (meth)acryloyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.