Interface assembly for thermally coupling a data acquisition system to a sensor array
US7586096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2006 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Jun 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01T1/2985
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.