Micro device and manufacturing method thereof
US7586118B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Jul 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/135
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro device and manufacturing method thereof. The micro device includes a substrate, an insulation layer, and a solution. The insulation layer is disposed on the substrate to define a channel portion and an extension portion communicated with the channel portion. The solution is location in the channel portion. Part of the solution flows to the extension portion by capillary force between the channel portion and the extension portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.