Single chip with multi-LED

US7586129B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Chih-Peng Hsu · Danei, TW
• Chester Kuo · Taipei, TW
• Chih Pang Ma · Hsinchu, TW

Key dates

• Filing date: Dec 1, 2006
• Grant date: Sep 8, 2009
• Expiry date: Jun 6, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

A single chip with multi-LED comprises a substrate on which an N-type semiconductor layer, an active layer and a P-type semiconductor layer are successively stacked. At least one N-type electrode is connected to the N-type semiconductor layer, and is exposed to an opening through the active layer and the P-type semiconductor layer. Further, at least one groove divides the P-type semiconductor layer into a plurality of separated regions, and a P-type electrode is disposed on each separated region.