Multilevel semiconductor module and method for fabricating the same
US7586183B2 · kind B2 · utility
8Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2006 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Apr 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.