Integrated circuit apparatus with heat spreader
US7586191B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 11, 2005 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Dec 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in electrical communication with terminals of at least one semiconductor device. An electrically insulating heat spreader is chemically bonded to each of the vias at an upper layer of the electrical interconnection network. At the upper layer the vias are electrically isolated from each other. In some embodiments the electrically insulating heat spreader is a polycrystalline diamond body with a metallized undersurface. The metallized undersurface may be etched away between vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.