Semiconductor device
US7586195B2 · kind B2 · utility
2Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2006 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Aug 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component for microwave transmission includes a high resistivity substrate on which is at least located several metallization layers divided into portions. A first set of piled up portions defines a ground ribbon and a second set of piled up portions defines a power ribbon. At least a first active portion of said ground ribbon and a first active portion of said power ribbon are respectively located between the substrate and an uppermost one of the several metallization layers. The electronic component in one implementation is a coplanar waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.