Patent · US Active

Innerlayer panels and printed wiring boards with embedded fiducials

US7586198B2 · kind B2 · utility

2Cited by

6References

6Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

William Borland · Cary, US
Saul Ferguson · Albuquerque, US
Diptarka Majumdar · Albuquerque, US
Matthew C. Snogren · Littleton, US
Richard H. Snogren · Schreiber, CA

Key dates

Filing date	Dec 29, 2005
Grant date	Sep 8, 2009
Priority date	—
Expiry date	Mar 4, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.