Unique airflow path using fungible chassis components
US7586745B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2006 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Aug 17, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis assembly for an electronic device such as a storage device. The assembly includes a chassis for housing various functional components included in the electronic device. A sub-housing for containing a waste heat generating device, a device which requires temperature moderation, is included. The sub-housing defines a first airflow exhaust path for exhausting air in a first direction and a second airflow exhaust path for exhausting air in a second direction. The directing of airflow from the sub-housing is based on a chassis enclosure configuration such as to allow for the implementation of a common component including a component enclosure in a variety of chassis form factors. A method of controlling airflow in a electronic device enclosure includes the steps of utilizing a fan to generate a flow of air, directing the flow of air through a sub-housing including a waste heat generating device, and implementing the electronic device enclosure to selectively direct the exhaust path of the generated airflow from the sub-housing base on the configuration of the electronic device enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.