Upstream plasma shielded film cooling
US7588413B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2006 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | May 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S415/914
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An upstream plasma boundary layer shielding system includes film cooling apertures disposed through a wall having cold and hot surfaces and angled in a downstream direction from a cold surface of the wall to an outer hot surface of the wall. A plasma generator located upstream of the film cooling apertures is used for producing a plasma extending downstream over the film cooling apertures. Each plasma generator includes inner and outer electrodes separated by a dielectric material disposed within a groove in the outer hot surface. The wall may be part of a hollow airfoil or an annular combustor or exhaust liner. A method for operating the upstream plasma boundary layer shielding system includes forming a plasma extending in the downstream direction over the film cooling apertures along the outer hot surface of the wall. The method may further include operating the plasma generator in steady state or unsteady modes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.