Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device
US7589018B2 · kind B2 · utility
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1References
19Claims
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Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a contact hole includes forming a first conductive layer patterned so as to serve as an electrode or a wiring on a substrate, forming an insulation layer on the substrate and the first conductive layer, inserting a cutting instrument into the insulation layer at an angle to a surface of the insulation layer, the angle being in the range from 5° to 80°, and forming a tapered opening extending to the electrode or the wiring in the insulation layer by drawing out the cutting instrument.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.