Apparatus and method for cutting flat stent precursors
US7589297B2 · kind B2 · utility
0Cited by
5References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2005 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Jul 31, 2027 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2/91
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting a planar medical component having a first surface and a second surface, comprising a clamp for fixing the component and applying a tensile force, a support having a surface having a hole therein, the upper surface disposed proximate the second surface of the component, and a cutting device having a cutting head disposed proximate the support and facing the first surface, wherein the support is configured to move along the plane of the component relative to the clamp and the cutting device cutting head is configured to hold position relative to the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.