Light emitting diode package and process of making the same
US7589354B2 · kind B2 · utility
6Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2005 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Nov 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.