SAW-component having a reduced temperature path and method for the production thereof
US7589452B2 · kind B2 · utility
8Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2005 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Aug 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02984
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Elements and methods for forming elements that operate with acoustic waves are disclosed. The element includes a piezoelectric electric substrate that has a first thermal coefficient of expansion, electrically conducting element structures on an upper side of the substrate, a compensation layer on an underside of the substrate, and an SiO2 layer over the element structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.