Laminated electronic component and method for manufacturing the same
US7589951B2 · kind B2 · utility
8Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2008 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Feb 13, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.