Multilayer electronic device and method for manufacturing the same
US7589952B2 · kind B2 · utility
7Cited by
10References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 25, 2008 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Apr 25, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.