Reconfigurable heat sink assembly
US7589971B2 · kind B2 · utility
1Cited by
22References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Jun 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting feature. At least one electrical component is in thermal contact with a portion of the at least one heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.