Patent · US Active

Filtered electrical interconnect assembly

US7590450B2 · kind B2 · utility

13Cited by

6References

14Claims

0Family size

Assignee

Medtronic, Inc. · US

Inventors

Rajesh V. Iyer · Eden Prairie, US
Shawn D. Knowles · St. Francis, US

Key dates

Filing date	Jan 30, 2006
Grant date	Sep 15, 2009
Priority date	—
Expiry date	Jan 4, 2027

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61N1/3754
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.