Pick-up head device with a pushing mechanism
US7591495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Aug 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder member has a first pressure passage, one end of the first pressure passage is connected to a suction member and another end of the first pressure passage is connected to a first pressure source, and the cylinder member is connected to a second pressure source so as to push at least one pushing tip. One of the first pressure source and the second pressure source is controllably selected by a pressure controller at a given time to have a pressure operation so as to enable the suction member to pick up an electronic component or to enable the pushing tip to push the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.