Method of producing silicon blocks and silicon wafers
US7591712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Jun 22, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the silicon blocks that can be produced into silicon wafers each having a thin thickness with reduced substrate damage at the time of producing a solar battery. The alkaline substance has a content mass that is at least 3.5% with respect to the mass of the entire liquid components of said slurry, and the slurry contains an organic amine having a mass ratio of 0.5 to 5.0 with respect to water in the liquid components of the slurry. The slurry is used at a pH of 12 or more and at a temperature of from 65 to 95 degrees C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.