Apparatus for sealing flex circuits having heat sensitive circuit elements
US7591924B2 · kind B2 · utility
1Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Aug 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.