Method for atmospheric pressure reactive atom plasma processing for surface modification
US7591957B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 1, 2001 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Nov 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2245/40
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.