Thin glass chip for an electronic component and manufacturing method
US7591958B2 · kind B2 · utility
2Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The manufacturing of electronic components on individual substrates made of an insulating material includes molding, in a silicon wafer, an insulating material with a thickness corresponding to the final thickness desired for the substrates, manufacturing the electronic components, and removing the silicon from the rear surface of the wafer after manufacturing of the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.