Seeding of HTC fillers to form dendritic structures
US7592045B2 · kind B2 · utility
28Cited by
66References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | May 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0248
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.