Epoxy resin compositions, processes utilizing same and articles made therefrom
US7592067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are epoxy resin compositions which include an alkali metal containing cure accelerator. The alkali metal containing cure accelerators are preferably alkali metal hydroxides, alkoxides, carboxylates, or alkali metal salts. Articles prepared from the resin compositions of the invention exhibit enhanced thermal properties, and similar non-thermal properties, when compared to articles prepared from compositions including other accelerators such as imidazoles. The resin compositions of the invention may be used for any purpose, but are particularly suited to be utilized in the manufacture of laminates for printed circuit boards and non-electrical structural applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.