Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement

US7592195B2 · kind B2 · utility

Assignee

• Micronas GmbH · DE

Inventors

• Markus Rogalla · Bad Krozingen, DE
• Ingo Freund · Endingen am Kaiserstuhl, DE
• Mirko Lehmann · Glückstadt, DE

Key dates

• Filing date: Feb 7, 2003
• Grant date: Sep 22, 2009
• Expiry date: Mar 29, 2024

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B7/0061
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers. The channel leading from one side of the arrangement to the sensor may be taken through the adhesive layer, through the protective cover, or through both. A hole may be formed i…