Method for smoothing and polishing surfaces by treating them with energetic radiation

US7592563B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Konrad Wissenbach · Würselen, DE
• Edgar Willenborg · Aachen, DE
• Norbert Pirch · Aachen, DE

Key dates

• Filing date: Jun 24, 2003
• Grant date: Sep 22, 2009
• Expiry date: Oct 7, 2024

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B1/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface is remelted in a first treatment step using said energetic radiation and employing first treatment parameters at least once down to a first remelting depth of approx. 5 to 100 μm, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface, wherein continuous radiation or pulsed radiation with a pulse duration of ≧100 μs is employed. The method makes it possible to automatically polish any three-dimensional surface fast and cost effective.