Method for welding contact plates and contact elements obtained with the method
US7592566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2002 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Dec 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for mutually welding a plate that has at least one layer based on Ag alloys and a copper body, comprising the use of laser means for performing the welding, its particularity consisting of the fact that it comprises the steps that consist in:—superimposing and coupling one face of the plate on a surface of the copper body;—starting the welding process by focusing the laser means on a point located proximate to the joint between the face of the plate and the surface of the copper body;—maintaining an angle of incidence of the laser means at values other than 0° with respect to the perpendicular to the surface to be welded;—moving the laser means with respect to the joint, so that the weldpool is pushed along the joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.